发明名称 Hot melt adhesives with excellent heat resistance
摘要 A hot melt useful for packaging, comprising from about 10% to about 30% by weight of at least one copolymer of ethylene and methyl acrylate (both acrylates and methacrylates); from about 10% to about 20% by weight of at least one copolymer of ethylene and n-butyl acrylate (both acrylates and methacrylates), wherein the total polymer content does not exceed 40% by weight, and the total ethylene n-butyl acrylate copolymer content does not exceed the total ethylene methyl acrylate copolymer content by percent weight in the adhesive; from about 20% to about 60% by weight of at least one tackifying resin selected from the group consisting of rosins and modified rosins and hydrogenated derivatives; aliphatic, cycloaliphatic and aromatic hydrocarbon resins and modified hydrocarbon resins and hydrogenated derivatives; terpenes and modified terpenes and hydrogenated derivatives; and mixtures thereof; from about 5% to about 30% by weight of at least one wax; and up to about 2% by weight of an antioxidant; wherein the resultant adhesive has peel values greater than about 150 DEG F. (about 65 DEG C.).
申请公布号 US5928782(A) 申请公布日期 1999.07.27
申请号 US19960749443 申请日期 1996.11.15
申请人 H.B. FULLER LICENSING & FINANCING, INC. 发明人 ALBRECHT, STEVEN W.
分类号 C09J123/08;(IPC1-7):C09J7/02 主分类号 C09J123/08
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