| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce machining time even if the number of positions to be machined is increased and to enable excellent machining by setting specifically the pulse oscillation frequency of a machining laser and setting its pulse time duration at a value capable of normally machining the position in accordance with the pulse oscillation frequency. SOLUTION: A stage 7 is positioned by a controller 10 in the manner that a fuse to be machined coincides with a machining laser in accordance with the coordinate of the fuse in the part to be machined. Then, a trigger signal is sent from the controller 10 to a laser beam source 1, generating a pulsed laser, and emitting the machining laser to a semiconductor device 8 through an objective lens 5 and the like for machining. In this case, the pulse oscillation frequency is set at 5 kHz or above while, in accordance with this frequency, the pulse time duration of the machining laser is set at a value capable of normally machining the fuse, namely, at 1-25 n sec. Consequently, since an energy margin can be taken wide, even a low output has no adverse effect on machining.</p> |
