| 摘要 |
PROBLEM TO BE SOLVED: To enable filling of wiring holes having a small diameter and a high aspect ratio, to improve the efficiency and to increase the EM life by constituting the copper alloy of a Cu-coordinated complex and an org. metal or metal complex of one or more kinds of metals selected from Zr, Sn, Mg, Cr, Ni, Cd and Mn. SOLUTION: The Cu-coordinated complex is a (+1) coordinated complex stabilized with ligands, or a complex with coordination ofβ-diketone to Cu. Especially, the complex hasβ-diketone coordinated to Cu and at least one stabilizing ligand bonded to Cu. As for theβ-diketone, trifluoroacetylacetone or hexafluoroacetylacetone can be used. As the stabilizing ligand, 1,5- cyclooctadiene or alkyl-substd. 1,5-cyclooctadiene can be used. Tetrakis dimethylaminozirconium or the like is cited as the org. metal or metal complex of Zr or the like.
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