| 摘要 |
PROBLEM TO BE SOLVED: To reduce a false report caused by a disagreement due to an inspection target and an image detection system and to detect a fine defect, by performing division into small region units and performing cutting, and then judging whether an area is a defect or a defect candidate based on the difference between first and second divided images being calculated for each division unit. SOLUTION: A scanning of electron beams is controlled for detecting an image with small distortion and at the same time the image is divided into a size so that a distortion can be ignored, and a position deviation is detected with accuracy being equal to or less than a picture element for each division unit, thus judging a defect. An inspection target 100 such as a wafer is scanned by electron rays 30, electrons being generated from the inspection target 100 are detected by applying the electron rays 30, the image of electron rays at a scanning site is obtained based on the intensity change, and pattern scanning is made by the image of electron rays, thus reducing a false report caused by such disagreement as the small difference in a pattern shape due to the side of an object to be inspected or an inspection device, a difference in a gradation value, a pattern distortion, and a position deviation and detecting a finer defect or a defect candidate. |
