发明名称 HIGH PURITY TANTALUM MATERIAL, TANTALUM TARGET USING THE SAME, THIN FILM FORMED BY USING THE SAME, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a tantalum material having purity higher than heretofore and a high purity tantalum target and also to obtain a thin film effective in inhibition of leakage current and a semiconductor device. SOLUTION: The high purity tantalum material has a composition containing <=50 ppm oxygen, <=0.05 ppm iron, <=0.05 ppm nickel, and <=0.05 ppm chromium and can be obtained by melting. The tantalum target is prepared by using the above high purity tantalum material. The thin film is formed by using this tantalum target. Further, the semiconductor device has this thin film at least in part.
申请公布号 JPH11193436(A) 申请公布日期 1999.07.21
申请号 JP19980294706 申请日期 1998.10.02
申请人 TOSHIBA CORP 发明人 OBATA MINORU;KOBANAWA YOSHIKO
分类号 C23C14/34;C22C27/02;H01L21/203;(IPC1-7):C22C27/02 主分类号 C23C14/34
代理机构 代理人
主权项
地址