| 摘要 |
Objectives: To improve the cutting sharpness and life while the manufacturing cost is being lowered. Solution mechanism: The whetstone particle layer (13), which consists of multiple whetstone particle layer units (12), . . . , is configured on the surface (11a) of the whetstone substrate (11) while the respective whetstone particle layer units (12) are being mutually linked via the bridge unit (9). The non-whetstone particle unit (22) is configured between [adjacent] whetstone particle layer units (12) and (12). [Each] whetstone particle layer unit (12) is obtained by configuring the superwhetstone particles (14) densely in the central unit (12a) and by configuring them sparsely in the peripheral unit (12b). The metal coupling phase (17), to which the superwhetstone particles (14) are fixed, is formed by the first and second metal plate phases (15) and (16), respectively. The thickness of the first metal plate phase (15) decreases from the central unit (12a) toward the peripheral unit (12b) in the shape of a mountain.
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