NONCONTACT IC CARD AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To decrease the number of manufacturing processes and cost by connecting a winding coil directly to input/output terminals made of aluminum provided on a semiconductor chip with a conductive adhesive containing epoxy resin as a base agent. SOLUTION: Input/output terminals 3 made of aluminum are provided on an IC chip 1 at two positions and the terminations (head part and tail part) of a winding coil 8 made of copper are connected onto the input/output terminals 3 by using conductive paste 12. Epoxy resin with which granular silver is mixed is used as conductive paste. The conductive paste 12 containing silver easily forms alloy with the input/output terminals 3 made of aluminum unlike a Pb-Sn based solder material which is conventionally used, so the input/ output terminals 3 and winding coil 8 can be fixed directly and connected electrically. Further, the difference in rigidity between the adhesive and an intermediate layer formed of epoxy resin filling an IC card can be reduced to relax stress concentration on the boundary surface between the both.