发明名称 |
Apparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processing |
摘要 |
The temperatures of scavenger-emitting kit parts in a high-density plasma (HDP) etching system are elevated to or close to respective steady state equilibrium temperatures so that scavenger chemistry and rates remain substantially the same on a wafer-to-wafer basis. A relatively inert warm-up plasma is turned on within the HDP chamber during idle time periods that precede or occur between executions of a predefined plasma-processing recipe so as to raise the temperatures of chamber-internal kit parts.
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申请公布号 |
US5925212(A) |
申请公布日期 |
1999.07.20 |
申请号 |
US19950524135 |
申请日期 |
1995.09.05 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
RICE, MICHAEL;GROECHEL, DAVID W.;CRUSE, JAMES;COLLINS, KENNETH S. |
分类号 |
C23F4/00;H01J37/32;H01L21/302;(IPC1-7):C23F1/02;C23C14/00;B44C1/22;C03C15/00 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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