| 摘要 |
A method of producing a ceramic-metal substrate, in which a cooper foil is superficially attached on at least one surface side of a ceramic layer a first metal layer formed by a metal foil, preferably a copper foil. The ceramic layer is then slit after applying the first metal layer, by removing the material of the ceramic layer down to first metal layer. At least one slit at a time is then made in the ceramic layer along at least two edges of the ceramic layer and at a distance from these edges, and extends over the entire length of the edge so that on either side of each slit there is a first ceramic layer section which has the respective adjacent edge and another ceramic layer section. The width of the slit is at least equal to twice the thickness of the ceramic layer. The metal layer is bent 180 DEG in the area of the slits such that the first metal layer forms at least two U-shaped contacts with legs which form on the top of the substrate top contact surfaces which are attached to the other ceramic layer section, and form on the bottom of the substrate bottom contact surfaces. The top and bottom contact surfaces are parallel to one another and are joined to one another on the substrate edge, and in the produced substrate the top and bottom contact surfaces are spaced apart from one another at least by two ceramic layers which are formed by the respective outer first ceramic layer section and the other ceramic layer section.
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