| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive tape substrate having an excellent slipping property on the back surface and capable of improving the production yield of semiconductor chips, to provide an adhesive tape, and to provide a release tape-attached adhesive tape. SOLUTION: An adhesive tape substrate 1 for fixing semiconductor wafers to an adhesive-coated layer 2 on the front surface side among a plurality of resin layers through an adhesive layer 7, wherein a silica particle-containing layer 4 on the back surface side among the plurality of resin layers contains silica particles 5. The silica particles 5 contained in the silica particle-containing layer 4 on the back surface side contributes to form the uneven surface on the back surface side. Since the silica particles 5 are buried in the silica particle- containing layer 4, the silica particles 5 are not separated from the silica particle-containing layer 4 or not adhered to a die bonder, when the tape 10 is deformed with a tension.</p> |
