Method of producing a semiconductor wafer and a cleaning apparatus for the same

摘要

A method of producing a semiconductor wafer in which a semiconductor wafer cut by a wire saw can be cleaned efficiently and in automatic steps and abrasive grains are substantially completely removed away, and a cleaning apparatus for the method are provided. A semiconductor ingot is cut by a wire saw into cut semiconductor wafers. Each of the cut semiconductor wafers is degrease-cleaned, the semiconductor wafer which has been degrease-cleaned is oil-water separation-cleaned, the semiconductor wafer which has been oil-water separation-cleaned is rinsed, abrasive grains are removed away from the surface of the semiconductor wafer which has been rinse-cleaned, by alkali cleaning, the semiconductor wafer which has been abrasive grain removal-cleaned is separated from a slicing plate.