| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a hybrid IC where high density, downsizing, and reduction of manufacture cost can be realized. SOLUTION: A hybrid IC 1 has a circuit board 2 which has an electrode pattern at the surface and is constituted, with parts 3 mounted, and a connector terminal 4 which has a first lateral board and a second lateral boards opposed to each other and a first longitudinal board and a second longitudinal board opposed to each other for coupling these first lateral board and second lateral board with each other and is made in the shape of roughly a square case. Here, one hand of the lateral board of the connector terminal 4 is connected and fixed to the connecting electrode 2a of the circuit board 2. In this manner, the manufacture cost can be reduced by omitting the process exclusively used for connection of the connecting terminal 4. Moreover, only the necessary connector terminal can be mounted in optional position, unnecessary operation can be eliminated, and the degree of freedom in design of the hybrid IC 1 can be raised, and high density, downsizing, and weight reduction can be contrived.</p> |
