发明名称 MANUFACTURE OF METAL CORE MULTILAYER SHIELD BOARD
摘要 <p>PROBLEM TO BE SOLVED: To reduce the manufacturing time by preparing a secondary prepared set of boards having Cu-foils laid through insulation layers on the outmost surface of two metal cores of a prim ary prepared set of boards and heating and pressing them to form a laminatedly integrated metal core multilayer shield board of a given no. of layers. SOLUTION: The manufacturing method comprises placing an alternately combined board 55 composed of an inner layer board 52 formed of a double- sided Cu-lined laminate board having arbitrarily processed circuits and two insulation layers laid on both sides thereof, between two metal cores 10 to position and form a prim. board set of board 5, by using positioning pins 54, laminating Cu foils through insulation layers 21 on the outer surfaces of the two outermost larger Al cores 10 to form a sec. secondary prepared set of boards 60, heating and pressing to laminate and integrate them to obtain an Al core shield board 70 having [4+(N-1)×2] layers (N is no. of the inner layer boards with circuited both faces). This constitution simplifies the process and reduces the working time.</p>
申请公布号 JPH11186734(A) 申请公布日期 1999.07.09
申请号 JP19970356994 申请日期 1997.12.25
申请人 MITSUBISHI PLASTICS IND LTD 发明人 SANO MITSUTOSHI;IWASAKI KANAME
分类号 H05K3/44;H05K3/46;H05K9/00;(IPC1-7):H05K3/46 主分类号 H05K3/44
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