| 摘要 |
PROBLEM TO BE SOLVED: To provide a high thermal conductivity, by forming an adhesive layer which contains a specified weight % of high thermal conductive inorganic filler and is composed of organic binder on one face of copper foil whose thickens in not less than a specified value. SOLUTION: High thermal conductive inorganic filler, inorganic binder and organic solvent are sufficiently kneaded by using three rolls and the like. Paste obtained by degassing is uniformly applied to one face of copper foil and solvent vaporized and formed. The thickness of copper folk is set to be not less than 100μm. A structure of used high thermal conductive inorganic filler is powder, and the particle size of a maximum particle is made to be smaller than the thickness of the adhesive layer when the adhesive layer is thermally adhered to a lead frame by pressing. The content of high thermal conductive inorganic filler is desirable to be 30-80 weight % against the adhesive layer and 40-60 weight % is much more desirable. Copper foil with adhesive, in which thermal conductivity of the adhesive layer itself is improved, is suitable as copper foil with adhesive which requires high heat radiation ability and which is used for a semiconductor device. |
