| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer wiring substrate in which generation of any solder crack can be prevented at solder connection with a semiconductor part having a matrix-shaped electrode. SOLUTION: Connection pads 5, 6, and 7 formed corresponding to plural electrodes 3 of a semiconductor part 2 are formed with a difference in level, so that solder height of solders positioned between the electrodes 3 and the connection pads 5, 6, and 7 can be made gradually higher, according as they go from the connection pad 5 connected with the electrode 3 positioned in the center of an electrode formation face 2a toward the connection pad 7 connected with the electrode 3 positioned outside the electrode formation face 2a in this multi-layer wiring substrate. |
