| 摘要 |
PROBLEM TO BE SOLVED: To avoid concentration of stress and prevent breakage of a ceramic chip, by forming an angle formed by a lower surface of a ceramic chip mounted on a land which is an electrode at a substrate side and a connection material obtuse. SOLUTION: Electrodes 2a, 2b of a ceramic capacitor 2 are fixed to lands 1a, 1b which are electrodes provided to a substrate 1 by a connection material such as solder 2c in a lower surface of the substrate 1 at a back fillet angle α. Since a lower surface of the ceramic capacitor 2 and the lands 1a, 1b are in parallel, the back fillet angle α is an angle formed by a lower surface of the ceramic capacitor 2 and the solder 2c. Therefore, concentration of stress can be reduced by making the back fillet angle αobtuse. As a result, breakage of a ceramic chip can be avoided. |
