发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To form a resist pattern excellent in adhesion to a substrate by incorporating a specified compd. having a specified average mol.wt. and contg. a specified amt. of polyethylene oxide groups based on the mol.wt. SOLUTION: The photoresist compsn. contains a compd. represented by formula I, having an average mol.wt. of 1,000-40,000 and contg. 5-90 wt.% polyethylene oxide groups based on the mol.wt. and/or a compd. represented by formula II, having an average mol.wt. of 2,000-30,000 and contg. 5-90 wt.% polyethylene oxide groups based on the mol.wt. as an adhesion enhancer. In the formulae I and II, A is a polypropylene oxide group and B is a polyethylene oxide group. Each of the compds. represented by the formulae I and II is a block copolymer of hydrophobic polypropylene oxide groups A [polymer groups having -CH(CH3 )CH2 O- as constituent units] and hydrophilic polyethylene oxide groups B [polymer groups having -CH2 -CH2 -O- as constituent groups] and the compds. are known as nonionic surface active components.
申请公布号 JPH11184080(A) 申请公布日期 1999.07.09
申请号 JP19970354695 申请日期 1997.12.24
申请人 SHIPLEY FAR EAST KK 发明人 NAKANO SHIGEKI;AWAJI AKIRA;OGAWA TERUAKI;TAKAHASHI KENTA
分类号 G03F7/085;G03F7/022;H01L21/027;(IPC1-7):G03F7/022;G03F7/023 主分类号 G03F7/085
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