| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor positioning mechanism which is lessened in size by a method wherein a positioning operation is carried out in the directions of an X axis andθby a single unit. SOLUTION: A link member 10 is connected through the intermediary of a kinematic pair to the tips of arms 5a and 5b which move linearly and separately back and forth keeping in parallel with each other. A handling part 11 is provided to the center side of the link member 10 extending vertically downward. A semiconductor chip 13 is handled by the handling part 11 in a vertical direction. When the the arms 5a and 5b are separately moved back and forth, the semiconductor chip 13 is moved in the directions of an X axis andθ, so that the semiconductor chip 13 can be positioned. As mentioned above, the semiconductor chip 13 can be positioned in the directions of an X axis andθat the same time by a single unit, so that the unit can be made smaller in size than a conventional one where an X direction movement unit and aθdirection rotation unit are separately provided and combined.
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