| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and its housing container which can prevent leads of the device from being damaged, by suppressing vibration of the device even when the container is rolled during transportation, etc. SOLUTION: Recessed stripes 6a and 6b are provided on a rectangular lower surface 5a of a package 3 in parallel with the opposite two side faces of the package 3, on which leads 2a and 2b are arranged, at prescribed distances from the side faces, and projecting stripes 10a and 10b which are fitted in the recessed stripes 6a and 6b are provided in a housing container 4 at the positions corresponding to the stripes 6a and 6b. When the package 3 and container 4 are constituted in the above-mentioned way, the relative vibration of a semiconductor device 20 in the container 4 is suppressed.</p> |
