发明名称 POLISHING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing device and method whereby nonuniformity of polishing can be easily corrected, and to polish so as to adjust a stock removable in aimed partial region of a polishing surface. SOLUTION: This device has a turntable 5 sticking a polishing cloth 6 in an upper surface and a top ring 1, a polishing object 4 is interposed between the turntable 5 and the top ring 1, and by pressing with prescribed force, the polishing object 4 is polished into flatness and mirror finished. Here, in a hold surface with the top ring 1 holding the polishing object, a plurality of vacuum suction possible openings 10 , 20 are provided, a plurality of the openings 10 , 20 are divided into a plurality of regions C1 , C2 , C3 , and vacuum suction is made possible in each region.
申请公布号 JPH11179652(A) 申请公布日期 1999.07.06
申请号 JP19970363952 申请日期 1997.12.17
申请人 EBARA CORP 发明人 WADA TAKETAKA;HIYAMA HIROKUNI;HIROKAWA KAZUTO;MATSUO NAONORI
分类号 B24B37/30;H01L21/304 主分类号 B24B37/30
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