| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesive strength of a preplating frame, especially Pd, Pd-Au, Ag, etc., to a resin composition and further the reflow resistance of a sealed semiconductor device, prevent the moisture resistance thereof from deteriorating after the reflow and provide the sealed semiconductor device having high reliability. SOLUTION: This resin composition for sealing consists essentially of (A) an epoxy resin, (B) a novolak type phenol resin, (C) tellurium diethyldithiocarbamate and (D) an inorganic filler. The amounts of the contained components based on the resin composition are 0.01-0.5 wt.% of the tellurium diethyldithiocarbamate of the component C and 25-95 wt.% of the inorganic filler of the component D. Furthermore, the sealed semiconductor device is obtained by sealing a semiconductor chip with a cured product of the resin composition. |
