| 摘要 |
PROBLEM TO BE SOLVED: To surely, detect disconnection even if bonding is performed for a part other than the regular bonding point (the electrode or the lead of a semiconductor) in wire bonding of the semiconductor chip. SOLUTION: A terminal-voltage detecting circuit 7 detects the terminal voltage between a wire 1 and a bonding stage 17 for the led frame making the reference potential point. An AC bridge 5 is a path connecting the wire 1 and a bonding index 17. A balance detecting circuit 6 detects the balance of the AC bridge circuit 5. Thus, the non-connection detecting circuit is constituted, and the non-connection between the wire 1 and the bonding point is detected. |
