| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce dispersion of electrical characteristics by heat-treating a surface of ceramic moldings containing material possibly scattered in firing, in such a manner that the surface comes into contact with a mixture of a scattered material, active powder and inactive powder. SOLUTION: A ceramic material containing zinc oxide and bismuth oxide is added and mixed with organic binder, and then discoidal ceramic moldings 1 with desired diameter and thickness is formed by applying pressure of 1 t/cm<2> . The binder is removed from such a formed ceramic moldings 1 at 500 deg.C, a powder mixture 2 of 50 cc is mounted on an aluminum oxide plate 3, and then the ceramic moldings 1 is mounted thereon. The powder mixture 2 of 50 cc is further mounted thereon to bury the ceramic moldings 1 into the powder mixture 2 and a sintered material is obtained by firing at 930 deg.C.</p> |
