| 摘要 |
<p>PROBLEM TO BE SOLVED: To manufacture a semiconductor device, even with a small sized semiconductor device package with high reliability where the semiconductor chip is mounted on a chip mount with an adhesive material via a required and proper amount of fillets, wires are surely bonded and no exfoliation or crack is caused even if thermal stresses are received. SOLUTION: A chip is mounted on a chip mount section 4 via an adhesive member 7, and the semiconductor device is manufactured by electrically connecting terminals of the semiconductor chip and a wiring pattern or inner leads. The adhesive member 7 is coated in a recessed form in the middle of each side of the chip mount section 4, and the semiconductor chip is adhered and mounted thereon.</p> |
