| 摘要 |
PROBLEM TO BE SOLVED: To obtain a substrate having excellent deposition and adhesive characteristics of a gold-flash evaporated layer forming an inductive coil by installing the single substrate, the inductive coil placed on one surface of the single substrate and at least one terminal pad electrically connected to at least a part of the inductive coil in a single-sided package. SOLUTION: A gold flash layer having gold in thickness of 7μinch is evaporated through a mask, and the coil 10 is formed onto the top face of the substrate 12. The substrate 12 is formed of an epoxy glass plate type material known as an FR4 epoxy glass plate. The chip 14 is mounted on the inside of the inductive coil 10 as the same side as the inductive coil 10 of the substrate 12, and a wire-bonding electrical- connection wiring 18 is formed to sections up to an inductive spot 22 on the substrate 12 from the end section 20 of the outer circumferential turn of the inductive coil 10 and further sections up to the terminal pad 24 of the chip 14 by using a wire bonding technique. Another inductive wire bonding 26 is mounted for connecting the end section 28 of the inner circumferential turn of the inductive coil 10 to the terminal pad 30 of the chip 14.
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