| 摘要 |
PROBLEM TO BE SOLVED: To provide a cavity type printed circuit board with embedded metallic core having superior heat dissipation, moisture resistance, heat resistance and electrical characteristics or the like. SOLUTION: In the manufacture of a printed circuit board, on which a semiconductor chip (j) is directly mounted and where circuit conductors and the semiconductor chip are connected through wire bonding, an open no-flow prepreg (f) with a hole for semiconductor mount is formed to one side of an inner layer use metallic plate (a) having a clearance hole (d) for a through-hole part (h),a high flow prepreg (g) is formed on the other side, and an outer layer use metallic foil (e) is laminated on both the sides. Then resin is filled in the clearance hole to form a laminated board with a metallic core where a semiconductor mount is not filled with the resin, through-holes are formed, the metal foil for the semiconductor mount is removed and is subjected to nickel plating and gold plating. |
