发明名称 COMPOSITE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To surely position a main terminal and a signal terminal at the prescribed position of a conductor pattern without using a special jig, and the allow lower edges of those terminals to be surely brought into contact with the conductor pattern, and to prevent them from being inclined and welded. SOLUTION: A device is provided with an insulating substrate 16 constituting a prescribed electric circuit in which an electronic part such as a semiconductor chip 19 is mounted on a conductor pattern 17, a heat radiating plate 18 on which the insulating substrate 16 is mounted, and an insulating case 10 covering this heat radiating plate 18. In this case, a main terminal 13 and a signal terminal 15 whose lower edges are fixed to prescribed position on the conductor pattern 17, and whose other edges are derived to the outside part of the insulating case 10 are insert molded on side walls 11a, 11b, 11c, and 11d of the insulating case 10.
申请公布号 JPH11177017(A) 申请公布日期 1999.07.02
申请号 JP19970363253 申请日期 1997.12.16
申请人 NIPPON INTER ELECTRONICS CORP 发明人 FUKUDA EIGO
分类号 H01L25/07;H01L25/04;H01L25/18 主分类号 H01L25/07
代理机构 代理人
主权项
地址