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发明名称
MODULE PACKAGE
摘要
申请公布号
KR100203936(B1)
申请公布日期
1999.07.01
申请号
KR19930005935
申请日期
1993.04.09
申请人
SAMSUNG ELECTRONICS CO, LTD.;FAIRCHILD KOREA SEMICONDUCTOR LTD.
发明人
JUN, KI-YOUNG;KIM, YOUNG-SOO
分类号
H01L25/00;(IPC1-7):H01L25/00
主分类号
H01L25/00
代理机构
代理人
主权项
地址
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