APPARATUS AND METHOD FOR MOUNTING A CHIP

摘要

An apparatus and a method for mounting a chip make it possible to accomplish quick chip mounting and also to mount multiple different chips on substrates. Three heads are provided around a center rod of a head assembly; they horizontally rotate around the center rod. When the heads rotate horizontally, they are turned 180 degrees vertically by a first bevel gear and a second bevel gear. A nozzle of one of the heads picks up a flip chip from a wafer sheet and rotates 180 degrees horizontally to transfer the flip chip to a transferring head, during which it vertically inverts 180 degrees so as to vertically invert the flip chip. The transferring head receives the flip chip from the head and mounts it on a substrate. According to the type of chips to be mounted, the heads and the transferring head are equipped with nozzles best suited for the type of chips.