SEMICONDUCTOR WAFER WITH INTEGRATED INDIVIDUAL COMPONENTS, METHOD AND DEVICE FOR THE PRODUCTION OF SAID SEMICONDUCTOR WAFER
摘要
The invention relates to a semiconductor wafer with integrated individual components, to a method for the production of said semiconductor wafer and to a device for implementing said method.
申请公布号
WO9933107(A1)
申请公布日期
1999.07.01
申请号
WO1998EP07201
申请日期
1998.11.11
申请人
DAIMLER-BENZ AKTIENGESELLSCHAFT;WILDE, JUERGEN;MERKEL, KARL-HEINZ;STROHM, KARL
