发明名称 |
DIFLASH METHOD OF SEMICONDUCTOR PACKAGE |
摘要 |
A semiconductor package lead deflash method comprises the steps of forming a plating thin film on a plurality of leads, weakening an adhesive force of the plating thin film, and removing a flash and the plating thin film formed therebeneath respectively from the plurality of leads. The lead deflash method enables complete elimination of the lead flash formed during a package fabrication, and additionally serves as a pollution deterrent by adopting a chemical-free deflash method. |
申请公布号 |
KR100206910(B1) |
申请公布日期 |
1999.07.01 |
申请号 |
KR19960021532 |
申请日期 |
1996.06.14 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO.,LTD. |
发明人 |
CHOI, SIN |
分类号 |
H01L21/56;H01L21/48;H01L23/28;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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