Undercoating agent for multilayer printed circuit board

摘要

An undercoating agent for a multilayer printed circuit board which comprises: (a) a normally solid epoxy resin having a softening point of 45 DEG to 120 DEG C., (b) an epoxy resin curing agent, (c) a diluent in which the epoxy resin is dissolved and which consists of a photopolymerizable monomer, and (d) a photopolymerization initiator, said undercoating agent being effectively used in the production of a multilayer printed circuit board which utilizes making the undercoating agent tack-free by irradiation with active energy beams and the main curing of the undercoating agent by heating.