| 发明名称 |
MANUFACTURE PROCESS LEAD FRAME OF PACKAGE HAVING FREE-MOLD |
| 摘要 |
An improved lead frame with a pre-mold paddle for a semiconductor chip package which prevents delamination and cracking between a mold body and the pre-mold paddle on which a semiconductor chip in the semiconductor chip package is placed. |
| 申请公布号 |
KR100205353(B1) |
申请公布日期 |
1999.07.01 |
| 申请号 |
KR19960073493 |
申请日期 |
1996.12.27 |
| 申请人 |
HYUNDAI MICRO ELECTRONICS CO.,LTD. |
发明人 |
LEE, BYUNG-DUK |
| 分类号 |
H01L23/28;H01L21/56;H01L23/495;H01L23/50 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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