| 摘要 |
A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin, the printed circuit board having a metal sheet of nearly the same size as the printed circuit board nearly in the center in the thickness direction of the printed circuit board, the metal sheet being insulated from front and reverse circuit conductors with a heat-resistant resin composition, the metal plate being provided with a clearance hole having a diameter greater than the diameter of each of at least two through holes, the through holes being provided in the clearance hole, the through-hole or through-holes being insulated from the metal sheet with a resin composition, at least one through-hole being connected to the metal sheet, one surface of the metal sheet being provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, the semiconductor chip being fixed on the protrusion portion. <IMAGE> |
