发明名称 |
Method for forming an interconnect for testing unpackaged semiconductor dice |
摘要 |
A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern of microbump contact members corresponding to a pattern of bond pads on the die. The compliant layer can be formed of a curable adhesive such as a silicone elastomer. A coupon containing a plurality of microbump tapes can be mounted to a substrate wafer which can then be singulated to form a plurality of interconnects. The interconnects can be used with a testing apparatus for testing unpackaged semiconductor dice.
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申请公布号 |
US5915755(A) |
申请公布日期 |
1999.06.29 |
申请号 |
US19970953711 |
申请日期 |
1997.10.17 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
GOCHNOUR, DEREK;FARNWORTH, WARREN M. |
分类号 |
G01R1/04;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/60;H01L21/66;H01L21/68;H01L23/13;H01L23/498;H05K3/00;H05K3/42;(IPC1-7):H01R9/00 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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