发明名称 Charge coupled device and electrode structure
摘要 In a method of manufacturing a charge coupled device, a channel layer is formed on a surface of a semiconductor substrate. Then, first layer transfer electrodes are formed in a charge transfer direction above the channel layer via a first insulating film. Subsequently, second layer transfer electrodes are formed such that each of the second layer transfer electrodes is disposed between two of the first layer transfer electrodes without any portion overlapping the first layer transfer electrodes in a plane structure. The second layer transfer electrodes may be patterned after a polysilicon film is deposited and polished or may be polished after the polysilicon film is deposited and patterned.
申请公布号 US5917208(A) 申请公布日期 1999.06.29
申请号 US19960617368 申请日期 1996.03.18
申请人 NEC CORPORATION 发明人 HATANO, KEISUKE
分类号 H01L29/762;H01L21/339;H01L27/148;H01L29/768;(IPC1-7):H01L27/148 主分类号 H01L29/762
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