发明名称 |
Smart card having a thin die |
摘要 |
Thin semiconductor die (201), approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane (c-c') of a smart card (203), the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure. <IMAGE> |
申请公布号 |
EP0772153(A3) |
申请公布日期 |
1999.06.23 |
申请号 |
EP19960307635 |
申请日期 |
1996.10.22 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
CLIFTON, MARK BRADFORD;VERDI, FRED WILLIAM;FLYNN, RICHARD MICHAEL |
分类号 |
B42D15/10;G06K19/077;(IPC1-7):G06K19/077 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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