| 摘要 |
A lead-frame is provided which includes a base segment and a plurality of circuit trace segments extending from the base segment. At least one of the circuit trace segments includes a section which bridges over at least an adjacent circuit trace segment. The bridging circuit trace segment includes a first end, and a distal contact segment at an opposite end, which are positioned on opposite sides of the adjacent circuit trace segment. A lead-frame assembly which includes such a lead-frame, and methods of fabricating the lead-frame and lead-frame assembly, are also provided. <IMAGE> |
