| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent wrong recognition of identification of a vacuum state and the consequent damage of a wafer, a reticle, or the like by installing a digital vacuum sensor in a vacuum line for moving an object such as the wafer by a vacuum suction system. SOLUTION: In a vacuum suction device for a semiconductor manufacturing installation for vacuum-sucking an object such as a wafer 41 or a reticle by a soft placing part 40 to move the object for a specified semiconductor device manufacturing process, a digital vacuum sensor 44 is installed in a vacuum line 42 creating vacuum on the upper face of the soft placing part 40 with the soft placed object. The suction and release state of the object is therefore sensed by the internal pressure of the vacuum line 42. Mechanical adjustment is unnecessary for the digital vacuum sensor 44, so that there is no vacuum sensing malfunction.</p> |
