DRILLING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD AND ITS DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce manufacturing cost by carrying out rough positioning and corrected value measurement by using a common X-ray plant and to shorten tact time by carrying out simultaneous treatment of the corrected value measurement and drilling work. SOLUTION: An X-ray measurement part measures rough positioning quantity of a multilayer printed circuit board at a large visual field measurement level in a measuring region B, and a carry-in hoist 16 carries out rough positioning of the multilayer printed circuit board. Additionally, the X-ray measurement part measures a corrected value to move a drilling part 13 to the optimum position at a small visual field level. After a board fixing table 18a carries the multilayer printed circuit board to a working region C from the measuring region B, a driving part 19 drives the drilling part 13 in the working region C, and the drilling part 13 performs drilling work at the optimum position.