| 摘要 |
A semiconductor chip defines an active surface on which a plurality of signal pads, a plurality of power source pads and a plurality of grounding pads are provided. A flexible insulation substrate defines an opening section by removing a section of the insulation member, and a power source conductor pattern and a grounding conductor pattern are formed to extend across the opening section. The power source conductor pattern and the grounding conductor pattern are provided with connection branches that are narrower than power source pads and grounding pads. |
