发明名称 |
Electronic component mounting base board and method of producing the same |
摘要 |
An electronic component mounting base board comprises an insulating substrate provided with a mounting portion for mounting an electronic component and a heat-sink plate disposed on an lower surface of the insulating substrate, in which the insulating substrate is provided with a wiring pattern for signal or power, a grounding pattern and a grounding hole, and the grounding hole is provided on its inner wall with a metal plated film for electrically connecting to the grounding pattern and a solder is filled in an inside of the grounding hole for electrically connecting to the heat-sink plate.
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申请公布号 |
US5914859(A) |
申请公布日期 |
1999.06.22 |
申请号 |
US19970837793 |
申请日期 |
1997.04.22 |
申请人 |
IBIDEN CO., LTD.;TEXAS INSTRUMENTS JAPAN, LTD. |
发明人 |
TAKADA, MASARU;TSUKADA, KIYOTAKA;NAKAO, MORIO |
分类号 |
H05K1/02;H01L23/36;H01L23/498;H05K1/18;H05K3/00;H05K3/34;H05K3/38;H05K3/44;H05K9/00;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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