| 摘要 |
PROBLEM TO BE SOLVED: To provide temporary fixing insulating paste which has excellent rubbing performance, adhesion, printability, and quick-drying performance of a film by water or hot water, for example, hot water of 80 deg.C, and simplifies manufacturing process of semiconductor devices and a variety of electronic components, also safely complies with regulation of organic solvent in electronic parts manufactures. SOLUTION: Essential ingredients of this paste are a synthetic resin soluble in water or warmed water, e.g. a partial saponified matter of polyvinyl alcohol and a high-molecular-weight saturated polyester resin, etc., fine silica powder, e.g. aerogel having an average grain size below 1μm or less, etc., and insulating powder. Thus the paste is used for temporal insulating adhesion.
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