| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package board in which disconnection between a solder bump and a via hole is prevented from being disconnected. SOLUTION: A solder bump 76D of a motherboard 90 is formed on a via hole 160D, whereby the solder bump 76D is connected directly to a via hole 160. Therefore, heat cycles cause cracks in a resin body 94 which seals up a package board 100 and the motherboard, and even if the cracks extend up to the package board 100, the solder bump 76D will not be disconnected from the via hole 160D.</p> |
