| 摘要 |
PROBLEM TO BE SOLVED: To secure sufficient wire bond strength by preventing occurrence of damages to an element, while maintaining the characteristics of the element. SOLUTION: In a semiconductor light-emitting element provided with a ring- shaped electrode 7 for wire bond which surrounds a light-emitting window 71 on the surface of an element 1, a projection 61 having a width smaller than that of the electrode 7 is made along the edge portion of the element, and by using this projection 61, a level difference 72 or a slope 73 is formed to make the central part lower than the peripheral portion of the element on the surface of electrode 7 for wire bond. |
