| 摘要 |
<p>A semiconductor device includes a pair of semiconductor switching elements (1a, 1b) and a board (3). Each semiconductor switching element has positive and control electrodes formed on one surface and a negative electrode formed on the other surface. The positive and control electrodes of one of the semiconductor switching elements are joined to the board, and the negative electrode of the other semiconductor switching element, which faces in a direction opposite to that of one of the semiconductor switching elements, is joined to the board. <IMAGE></p> |
