发明名称 Semiconductor device and method of manufacture
摘要 The transistor comprises a gate insulating film 2, a gate electrode 3, a source-drain region 7 and a sidewall insulating film formed at a sidewall of the gate electrode, wherein the sidewall insulating film has a double layered structure made up of a TEOS NSG film 5 which is in contact with both the sidewall of the gate electrode and the surface of the semiconductor substrate and a silicon nitride film 6 which is formed on the TEOS NSG film. The transistor provides an improvement in the hot carrier resistance and is highly reliable, with the ON current showing little change over a long period.
申请公布号 GB9909042(D0) 申请公布日期 1999.06.16
申请号 GB19990009042 申请日期 1999.04.20
申请人 NEC CORPORATION 发明人
分类号 H01L21/336;H01L29/49;H01L29/78 主分类号 H01L21/336
代理机构 代理人
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