发明名称 |
ADDITION METHOD OF LEAD AND CHIP, OF LEAD ON CHIP PACKAGE |
摘要 |
<p>A method for bonding a semiconductor chip to a lead frame in a LOC type semiconductor package in which a plurality of inner leads are bonded to an active surface of the semiconductor chip. A semiconductor chip is prepared with a partially-cured polyimide layer on the active surface. One or more strips of polyimide tape is attached to the inner leads. The semiconductor chip is attached to the inner leads by making an intermediate pressure bond between the polyimide tape and the partially-cured polyimide coating layer on the active surface. The polyimide coating layer is then cured.</p> |
申请公布号 |
KR100196285(B1) |
申请公布日期 |
1999.06.15 |
申请号 |
KR19960011812 |
申请日期 |
1996.04.18 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
SIM, SUNG-MIN;SONG, YOUNG-HEE;KWON, YOUNG-DO;SON, HAE-JUNG |
分类号 |
H01L21/60;H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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