| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad with little aging in mechanical characteristics even if it absorbs moisture in a polishing process or in standby state, capable of improving productivity of a semiconductor device by reducing frequency of polishing pad replacement. SOLUTION: This invention is related to a polishing pad having both a hard material layer 1 made of foamed polyurethane and the like and a soft material layer 3 made of polyurethane impregnated unwoven cloth and the like where a part of the hard material layer 1 is formed out of a water proofing material layer 2 made of polyurethane sheet for preventing moisture from intruding in the whole area of the hard material layer 1. This water proofing material layer is made of more than one material selected from a group of polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride and fluororesin. |
