发明名称 |
AUTOMATIC STACKING AND SOLDERING APPARATUS AND A METHOD FOR PRODUCING THREE DIMENSIONALLAY STACKED PACKAGE DEVICE |
摘要 |
<p>An automated apparatus for three dimensional stack package devices provides mass production of J-lead type stack packages. The apparatus includes a package loader and a package loader/unloader for loading upper and lower individual packages and for unloading packages which have been stacked and soldered; an indexing system for receiving and aligning the upper and lower individual packages and for transporting the stacked upper and lower packages, an applying unit for applying a solder flux or a solder paste to metal leads of the upper individual packages, first and second transfer tools for transferring the individual packages to the applying unit and to the indexing system; and a heating unit for heating the stacked upper and lower packages so that metal leads of the upper and lower packages are solder jointed.</p> |
申请公布号 |
KR100204171(B1) |
申请公布日期 |
1999.06.15 |
申请号 |
KR19970004680 |
申请日期 |
1997.02.17 |
申请人 |
SAMSUNG ELECTRONICS CO, LTD. |
发明人 |
KIM, JAE-JUNE |
分类号 |
H05K3/34;B23K3/06;B23K37/047;H01L21/50;H01L21/98;H01L23/48;H01L25/065;H01L25/07;H01L25/10;H01L25/11;H01L25/18;H05K13/04;(IPC1-7):H01L23/48 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|